• 专利附录
  • 专利说明
  • 权利要求
  • 类似技术
  • 同族专利
  • 引用文献
  • 法律状态
  • 优先权
    • 专利摘要:
    "Electronic module, especially for a gearbox control device" An electronic module (1) is proposed, for example as a gearbox control module for a motor vehicle. A first printed circuit board member (3), a frame member (5) and a cover member (7) hermetically enclose a receiving housing (11). On the first printed circuit board element are arranged electronic components (9) protected in the receiving housing. The module also comprises a second printed circuit board element (13) on which at least a second electronic component (15) is arranged. This second printed circuit board element is located at a distance, at least in certain partial areas, from the first printed circuit board element (3), and is electrically connected thereto, the second electronic components being arranged in the housing reception.
    公开号:FR3018989A1
    申请号:FR1552368
    申请日:2015-03-23
    公开日:2015-09-25
    发明作者:Gerald Kammer；Gerhard Wetzel；Harald Ott
    申请人:Robert Bosch GmbH；
    IPC主号:
    专利说明:

    [0001] Description Electronic module, particularly for gearbox control apparatus, comprising two superimposed printed circuit board elements.
    [0002] FIELD OF THE INVENTION The present invention relates to an electronic module, such that it can in particular be implemented for a gearbox control apparatus in a motor vehicle. State of the art Electronic modules are generally used to produce electrical control circuits, with which various functions can be implemented. The electrical control circuits can in this case, for example be part of a control device. Particularly in the field of automotive construction, electronic modules are used to produce control devices of the vehicle. In an electronic module are typically provided, on a printed circuit board element, also referred to as platinum or printed circuit board (PCB), a plurality of electronic components, which are electrically connected to each other at the same time. using conductive tracks. In particular for gearbox control devices in a motor vehicle, it may be advantageous to arrange an appropriate electronic module in an area in which it is exposed to aggressive fluids and agents. An electronic module of a gearbox control device can for example be arranged inside a gearbox of a motor vehicle, or chemically aggressive gearbox oil, dirt or chips. In particular, they may come into contact with the electronic module. As at least parts of the components, conductive tracks, etc., provided on the electronic module are sensitive to such aggressive agents or fluids or particles, it may be necessary to protect them with a hermetically sealed housing. In document DE 10 2012 213 917 A1, it has been proposed for an electronic module intended to be used in a gearbox control device, to implement, at least for a part of such a case, a printed circuit board element on which the electronic components and conductive tracks necessary for the formation of electrical circuits, are arranged on one face of the printed circuit board element, which is directed towards a receiving housing, and the housing of reception is made hermetically sealed, for example against aggressive agents or fluids, with the aid of an envelope element or a frame element, as well as, the where appropriate, using a cover element. DESCRIPTION AND ADVANTAGES OF THE INVENTION In accordance with embodiments of the present invention, there is provided an electronic module, which advantageously develops, in particular the electronic module described in the introduction. In particular, it is possible to reduce the size of implantation of an electronic module and / or to extend the life of such an electronic module. According to one aspect of the present invention, there is provided an electronic module, which comprises a first printed circuit board element on which is arranged at least a first electronic component, a frame member, and a cover member. The first printed circuit board element, the frame member and the cover member together hermetically seal a receiving housing. The first electronic component is housed inside this receiving housing. The electronic module is characterized in that it has a second printed circuit board element on which is arranged at least a second electronic component, the second printed circuit board element being located at a distance, at least in certain partial areas, of the first printed circuit board element and being electrically connected to the first printed circuit board element, and the second electronic component being further arranged in the receiving housing. Ideas for embodiments of the electronic module proposed herein may be among others, be considered as based on the findings and principles described below. It is known that electronic modules, which contain complex circuits, may require significant space, and therefore have a considerable size. In the case of such electronic modules, it may be necessary to arrange a large number of electronic components on a printed circuit board element and switch them on mutually.
    [0003] Usually, all the electronic components were arranged on one side of a single printed circuit board element, so that this printed circuit board element had to have a surface large enough for this purpose. At present, it is proposed to provide in the same electronic module, at least two printed circuit board elements, both of which carry electronic components. These two printed circuit board elements can be arranged at a distance from one another, that is to say superimposed, in different planes. A first of these printed circuit board elements here must hermetically seal, in common with the frame member and the cover member, a receiving housing, so that the electronic components arranged on this element of printed circuit board, can be housed in a protected manner. In other words, this first printed circuit board element can form a part of a housing, the remainder of the housing being constituted by the frame element and the cover element, and the enclosure enclosing generally hermetically sealed, receiving housing. In addition to this first printed circuit board element, there is provided for the electronic module, a second printed circuit board element on which are also arranged electronic components, which likewise are arranged in the receiving housing and thus, because of the hermetic seal of the latter, are protected against the influence for example of agents or aggressive media of the environment.
    [0004] Overall, the space occupied by such an electronic module can be considerably smaller than in the case of conventional electronic modules, because the electronic components provided inside, no longer need to be all arranged in a single plane on the first printed circuit board element, but may instead be arranged in different planes along the two printed circuit board elements. In other words, the electronic components can be arranged not only distributed on a surface, but distributed in space. In addition to the advantage of reduced space requirement, the first printed circuit board element may also have a smaller base area compared with conventional electronic modules, so that mechanical stresses due for example to thermal expansion and, in principle, in correlation with the size of the parts considered, may be less important than in the case of conventional electronic modules. The printed circuit board element, the frame element and the cover element may for example be made of different materials, which behave differently under the effect of temperature variations. Due to the smaller dimensions of the electronic module proposed here, as to the surface of the first printed circuit board element, compared to conventional electronic modules, the thermal stresses that appear can, for this reason, be kept at a low level. . In addition, since the entire electronic module is composed of several printed circuit board elements, which can be superimposed in different planes, a modular construction is obtained for which it is possible to add in a modular manner or to exchange data. individual printed circuit board elements. According to one embodiment, the second printed circuit board element is supported, at least at partial areas of its edge, on the frame element. The frame element can thus fulfill two functions, that is to say firstly act as part of the housing enclosing or surrounding the receiving housing, and secondly maintain the second circuit board element printed in such a way that the second electronic components provided on its surface are housed inside the receiving housing, and thus protected in a hermetically sealed manner against the outside. The second printed circuit board element can here bear with partial areas of its edge or with its complete edge, directly on corresponding areas of the frame element, or indirectly, that is to say for example be connected to the frame member through other parts, so as to be held in position. The second printed circuit board element may be arranged parallel to the first printed circuit board element, for example with a reciprocal spacing distance of a few millimeters, for example between 0.5 mm and 20 mm. Alternatively, the second printed circuit board element may be arranged inclined with respect to the first printed circuit board element. By way of example, a partial area of an edge of the second printed circuit board element can be kept away from the first printed circuit board element, for example by relying on the frame element, and a Another edge region of the edge may be supported directly on or at least closer to the first printed circuit board element than the other partial area. In this way it is possible to make an electrical interconnection between the first and the second printed circuit board element simpler. According to one embodiment of the invention, the first printed circuit board element can be made from a thermosetting material, and micro-structuring can be carried out in the first printed circuit board element, at the an interface surface where the first printed circuit board element is adjacent to the frame element. Printed circuit board members can be made in a simple manner on the basis of a thermosetting material substrate, conductive tracks that can be formed on this substrate, at its surface or in intermediate layers. In the case of such conventional printed circuit boards, however, it has been observed that it may be difficult to reliably bond hermetically sealed the thermosetting material of the printed circuit board, for example to a thermoplastic material of a cover or frame element. However, it has been found that it is possible to obtain such a hermetically sealed connection, by producing in the thermosetting circuit board element, a micro-structuring in which can flow, for example, a thermoplastic material in a viscous state obtained by heating, thereby being in contact with it after solidification. The micro-structuring may include flatness irregularities in the micrometer or even the nanometer range, and may include cavities or pores at the surface of the printed circuit board element. Such micro-structuring can for example be produced by irradiation using a laser energy intensive. However, it is also possible to envisage other possibilities for carrying out micro-structuring, for example by mechanical machining or corrosive attack.
    [0005] According to one embodiment, the first printed circuit board element and the second printed circuit board element differ in their types of substrate. A printed circuit board element may, for example, have a coarsely structured substrate, while the second printed circuit board element may have a substrate with a thinner structure, for example in the form of a thin track HDI circuit. (Fineline-HDI High Density Interconnect). Alternatively, a printed circuit board element may be designed for the implementation of logic, while the other printed circuit board element may be provided for the implantation of a power electronics. It is thus possible, for example, to partition the entire functionality of an electronic module for a control device, by means of the various printed circuit board elements, which can for example be combined in the reception housing of the control module. Only one electronic module. According to one embodiment, the first printed circuit board element, the second printed circuit board element or both of the printed circuit board elements may be planar. In other words, the two printed circuit board elements may be in the form of conventional boards or circuit boards. At least the first printed circuit board element, if necessary also also the second printed circuit board element, may form a part of a housing surrounding or enclosing the receiving housing. According to one embodiment of the invention, the second printed circuit board element may be arranged to be located remotely, not only from the first printed circuit board element, but also, at least in partial areas, away from the lid element. In other words, the second printed circuit board element can certainly be arranged in the receiving housing, but not be directly applied by its surface against the cover element. On the contrary, the second printed circuit board element may be located at a distance of for example a few millimeters, for example between 0.5 mm and 10 mm, from the cover element, be arranged in a planar manner parallel to that ci, or also be arranged inclined with respect thereto. According to one embodiment of the invention, the second printed circuit board element is clamped, at least at partial areas of its edge, between the frame member and the cover member. In other words, the geometry of the second printed circuit board element and the geometry of the frame element can be suitably mutually adapted, so that the second printed circuit board element relies, for example, on a staging of the frame member, and so that at an opposite surface, the cover member bears against the second printed circuit board element, so that in the assembled state of the electronic module, the second printed circuit board element is held between the frame member and the cover member. In the case of such a method of attachment, it is possible, if necessary, to give up another type of attachment of the second printed circuit board element, for example by gluing or welding.
    [0006] According to another embodiment of the invention, the second printed circuit board element may form at least a portion of the cover member. In other words, it is possible, in this embodiment, that the second printed circuit board element is not provided as a separate part, in addition to the cover element, but on the contrary forms, in part or all of the lid element. The second printed circuit board element can thus itself be part of the housing hermetically sealing the receiving housing, the second electronic components to be provided on the second printed circuit board element, being able to be arranged on a surface of the second circuit board element so as to engage the receiving housing. The cover member may here be entirely formed by the second printed circuit board element, and in the case of such a configuration, the second printed circuit board element will have to be sealed to the frame, similarly to the first printed circuit board element. In the case of such a configuration, the two printed circuit board elements can, for example by means of micro-structuring provided therein, be reported in a hermetically sealed manner on the frame element, in particular when the two printed circuit board elements are made of a thermosetting material. As a variant, the second printed circuit board element may not be the only cover element, but it is possible, for example, to provide an additional cover frame element, which can be connected on the one hand to the second printed circuit board element and secondly to the frame element. According to one embodiment, the electronic module further comprises a third printed circuit board element, which is arranged transversely to the first and / or second printed circuit board element. While, for example, the first and second printed circuit board members may be arranged in a planar manner parallel to each other, and may in particular form parts of the housing enclosing the receiving housing, the third The printed circuit board element may be arranged transversely, ie for example vertically with respect to those printed circuit board members considered to extend horizontally. On the third printed circuit board element can be provided others, namely third electronic components. The receiving housing can thus be operated even more effectively for the arrangement of electronic components. According to another embodiment of the invention, on the first and / or the second printed circuit board element can be arranged, in a border area, an electronic component attached to the frame member. Such an attachment of electronic components to the frame member may in particular be advantageous for components, which otherwise would have to be otherwise stabilized on the printed circuit board element, for example because they must be positioned in position. protruding away from the printed circuit board element or because they are heavy. In particular, it may be advantageous to provide, on one of the printed circuit board elements, wire components, such as capacitors for example, and to support or fix them in addition to the frame element. The electronic component can be fixed here, for example by engaging in a suitable complementary configuration area of the frame. According to one embodiment of the invention, the first printed circuit board element can be electrically conductive connected to the second printed circuit board element by a bonding type electrical continuity link, a cable and / or a flexible film provided with a conductive track (FPC - Fexible Printed Circuit). Such electrical interconnection links can be made in a simple manner during assembly of the electronic module. It is for example possible to report flexible wires, cables or films with conductive tracks at appropriate connection points on the first and second printed circuit board elements, for example by providing an electrical continuity bond through Bonding, brazing, soldering, bonding, etc. The electrical interconnection links may for example be laid from one surface of one of the printed circuit board elements to another surface of the printed circuit board elements. . The electrical interconnection links here can extend entirely within the receiving housing. In this case, the second printed circuit board element should advantageously not totally cover the first printed circuit board element inside the receiving housing, so as to leave free zones in which the connection can extend. electrical interconnection between the two printed circuit board elements. The second printed circuit board element may, for example, be smaller than the base surface of the first printed circuit board element within the frame element, so that there are still partial areas which are not covered by the second printed circuit board element, and where an electrical interconnection link can be attached to the first printed circuit board element. Alternatively, for example, there may be provided in the second printed circuit board member suitable recesses through which electrical interconnection links may be laid. Alternatively or additionally, it is possible, according to an embodiment of the present invention, that the first printed circuit board element and the second printed circuit board element are electrically conductive connected by one or more contact elements suitable for blind mounting. Such contact elements adapted to a blind mounting, for example spring or spring contact pins, which are attached to one of the printed circuit board elements, and are supported, at the level of one resilient end against a mating piece on the other printed circuit board member. Other examples of contact elements suitable for blind mounting are card-to-board connectors or plug-in pins. With the aid of such contact elements suitable for blind mounting, the electronic module can be assembled in a simple manner, the electrical interconnection between the first and the second printed circuit board element being made in areas which are not are not or are difficult to access from the outside during assembly. Embodiments of the electronic module configured as proposed, are particularly suitable for the realization of a gearbox control apparatus, such that it can for example be arranged inside a transmission gearbox. a motor vehicle, filled with box oil. The electronic components implementing a function of the gearbox can here be arranged inside the receiving housing, and thus be sealed hermetically sealed and protected against attack by oil box agressive. Because of the arrangement of several printed circuit board elements in different planes, it is thus possible to obtain a small bulk of the gearbox control device, so that it can also be implanted in narrow gearbox housings.
    [0007] It should be noted that the characteristics and possible advantages of an electronic module according to the invention are described here with reference to various embodiments of the invention. Those skilled in the art are able to see that it is possible to combine or exchange the evoked features appropriately to achieve other embodiments of the invention. Drawings In the following, embodiments of the invention will be described with reference to the accompanying drawings, neither the description nor the drawings are to be considered as limiting the invention. - Figure 1 shows an electronic module according to the invention, comprising a second printed circuit board element supporting separately inside the receiving housing. FIG. 2 shows an electronic module according to the invention, comprising a second printed circuit board element bearing on both sides on a frame element. FIG. 3 shows another electronic module according to the invention, comprising a second printed circuit board element bearing on both sides on a frame element, as well as various examples for blind contact elements. FIG. 4 shows an electronic module according to the invention, comprising a first and a second printed circuit board element arranged inclined with respect to one another. - Figure 5 shows an electronic module according to the invention, comprising a second printed circuit board element bearing separately in the receiving housing. FIG. 6 shows an electronic module according to the invention, comprising a second printed circuit board element clamped between the cover element and the frame element. FIG. 7 shows an electronic module according to the invention, comprising passive cooling integrated into a cover element. FIG. 8 shows an electronic module according to the invention, in which the second printed circuit board element forms part of the cover element. FIG. 9 shows another electronic module according to the invention, in which the second printed circuit board element forms part of the cover element. - Figure 10 shows an electronic module according to the invention, comprising a third vertically arranged printed circuit board element. - Figure 11 shows a top view in the receiving housing of an electronic module according to the invention, and having an electronic component attached to the frame member. - Figure 12 shows a side view of a component attached to the frame member. The figures are only schematic and do not respect the scales. Identical references designate identical characteristics or identical action in the different figures. DESCRIPTION OF EMBODIMENTS OF THE INVENTION FIG. 1 shows an embodiment of an electronic module 1 comprising a first printed circuit board element 3, a frame element 5 and a cover element 7. On the first element of the printed circuit board 3 are arranged several first electronic components 9. The first printed circuit board element 3, the frame member 5 and the cover member 7 together enclose a receiving housing 11 in a hermetically sealed manner. For this purpose, on the first printed circuit board element 3 made of a thermosetting material, in a zone of interface with the frame element 5, is formed with the aid of a laser, a micro-structuring 21 which extends along the entire periphery of the ring-shaped frame member 5 when viewed from above. During the assembly of the electronic module 1, the thermoplastic material of the frame member 5 is heated temporarily and can, in the viscous state, penetrate cavities of this micro-structuring 21, so that after hardening, it there is a strong and hermetically sealed mechanical connection between the frame member 5 and the first printed circuit board element 3. The cover element 7, for example also made of a thermoplastic material, can be hermetically sealed to the frame member 5 along a periphery by plastic welding 23.
    [0008] The electronic module 1 furthermore comprises a second printed circuit board element 13. On the two opposite faces of the second printed circuit board element 13, second electronic components 15 are arranged. In this embodiment, the second printed circuit board element 13 is located at a distance from both the first printed circuit board element 3 and the cover element 7 and is arranged parallel thereto and is located between these two elements. Inside the receiving housing 11. On the first printed circuit board element 3, as well as on the faces of the second printed circuit board element 13, there are provided conductive tracks by which the different first and second electronic components 9, 15 are switched on. In the exemplary embodiment shown, conductive tracks of the first printed circuit board element 3 are electrically interconnected with conductive tracks of the second printed circuit board element 13, via an electrical continuity connection 17 (FIG. bonding). On the mechanical plane, the second printed circuit board element 13 bears, at a partial zone of its edge, shown on the left in FIG. 1, on a recess 19 of the frame element 5, which is directed to the receiving housing 11. Another partial region of the edge of the second printed circuit board element, which is shown on the right in the figure, is based on a partial support structure 25, which can be part of the frame element 5. The second printed circuit board element 13 is here fastened, for example by means of a hot matting or a detent pin 27, both to the frame element 5, that to the support structure 25. As the second printed circuit board element 13 has a base area smaller than that of the first printed circuit board element 3 within the frame member 5 , and thus does not completely cover the first element of printed circuit board, the electrical continuity bond 17 between the second printed circuit board member 13 and the first printed circuit board element 3, can extend through an adjacent partial area of the receiving housing 11. In the case of the embodiment shown in FIG. 2, the second printed circuit board element 13 bears, at two opposite edges, on recesses 19 which protrude from the frame element 5 towards the housing of FIG. 11, and is again fixed by hot matting or latching 27. There is no additional partial support structure. An electrical interconnection between the first and the second printed circuit board element 3, 13 is effected, in this case, through a notch 29 in the second printed circuit board element 13.
    [0009] As a connecting element and electrical connection, it is for example possible to provide a cable or a flexible conductive film (FPC) between the first and the second printed circuit board element 3, 13. In the mode of As shown in Fig. 3 (a), the second printed circuit board element is supported and fixed on a peripheral recess 19 of the inwardly projecting frame member 5. An additional partial support structure is here again useless. The electrical interconnection contact between the first and the second printed circuit board element 13 may be parallel to the mounting of the second printed circuit board element 13 on the recess 19 of the frame element 5. the necessary electrical interconnection between the two printed circuit board elements 3, 13, it is possible here to use contact elements 31 adapted to the blind mounting, for example in the form of the elastic contact pin or a spring 33 shown in Figure 3 (a). Alternatively, it is also possible to use, as shown in FIG. 3 (b), card-to-card connectors 35 or, as shown in FIG. 3 (c), plug-in pins 37, as elements of FIG. contact 31 suitable for blind mounting.
    [0010] In the case of the embodiment shown in FIG. 4, the second printed circuit board element 13 is not arranged parallel to the first printed circuit board element 3, but inclined with respect to it. The second printed circuit board element 13 touches here, along a partial area of its edge, the first printed circuit board element 3, and is, at an opposite partial area of said edge, again fixed to the frame member 5, away from the first printed circuit board member 3. An electrical connection contact between the two printed circuit board members 3, 13 may for example be effected via a solder connection 39. A minivagea can here wet from the outside, the second printed circuit board element, through a channel 41 in the first printed circuit board element, the solder can be traced back to through the channel 41 and then wetting / contacting a contact patch on the second printed circuit board element 13. After solidification of the first liquid solder, the two printed circuit board elements 3, 13 are electrically connected and the channel 41 in the first printed circuit board element 3 is sealed. The second printed circuit board element 13 may be attached, for example by heat-matting or snap hooks, to the inner side of the frame member 5, and additional support points may provide, in addition , a secure hold. As an alternative to an electrical interconnection link using solder introduced through a channel 41, the second printed circuit board element 13 can also be directly connected to conductive tracks on the first printed circuit board element 3 , for example using solder connectors or bonding electrical continuity links inside the receiving housing 11. FIG. 5 shows an embodiment of an electronic module 1, for which inside of the frame element 5 (the height of which is kept low for a better possibility of making bonding electrical continuity connections), a second smaller frame element 45 is provided inside the receiving housing, on which is fixed the second printed circuit board element 13. The second frame element 45 can here form an open or closed contour. The second frame member 45 may, if appropriate, similarly to the first frame member 5, be attached to the first printed circuit board element 3, via micro-structuring 46. A connection of electrical interconnection between the first and the second printed circuit board element 3, 13 can be realized, as shown, by bonds of electrical continuity by bonding 17. Where appropriate, it is possible in this embodiment, just as in all the other embodiments, to fill all or part of the receiving housing 11, and in particular the inner space 47 of the second frame member 45, with a gel, for example to better distribute or remove the heat produced by the components 9, 15, which are there. The embodiment of an electronic module 1 shown in FIG. 6 differs from those previously described, in particular in that the second printed circuit board element 13 bears directly against the cover element 7. For example, the second printed circuit board element 13 may be attached in a heat-resistant manner 49 to the cover element 7 made of plastic, for example. Alternatively or additionally, the second printed circuit board member 13 can be held tightly between the recess 19 of the frame member 5 and the cover member 7. An electrical interconnection connection between the first and second the second printed circuit board element 3, 13 may be effected, for example, via a partially flexible PCB circuit board strip, which is folded out of the plane of the second plate element of the circuit board. printed circuit board 13, and which is connected by resilient tongues with pads to the first printed circuit board element 3. As interconnect contact elements, it is also possible to use various other elements, for example, they can be assembled blindly. In the embodiment shown in FIG. 7, it is a variant of an electronic module 1 for which it is possible to discharge well, via the cover element 7 partly made of metal the heat of the second printed circuit board member 13, which is attached thereto. Such an embodiment is thus particularly well suited for providing power components producing a high lost heat. The cover member 7 here comprises a metal plate 51, which may be flat, or which may furthermore be provided with a cooling structure, for example in the form of cooling fins 53, in order to further improve the cooling capacity. The metal plate 51 may, for example similarly to the first printed circuit board element 3, be connected, via a partial micro-patterning 55 formed peripherally on one side, to a partial cover element 57 to be peripherally molded, by injection, in a subsequent step, so that a strong, sealed, leak-proof connection is formed between the metal plate 51 and the partial cover member 57 On the inner side of such a part, then can be glued, for example with a glue well conducive to heat, a printed circuit board element 13 completely equipped with electrical components 15. In Figure 8 is shown an embodiment of an electronic module 1, wherein the second printed circuit board element 13 forms at least a portion of the cover member 7. For this purpose, the second The printed circuit board element 13 partially comprises a peripherally extending micro-patterning. On the microstructure 61 is injection molded, peripherally, a partial frame member 57 of a thermoplastic plastic material. This may be of a one-sided configuration (as shown on the left in FIG. 8), or enveloping (as shown on the right in FIG. 8). After this manufacturing step, the second printed circuit board element 13 can be equipped with the components and be tested. In parallel thereto, the first printed circuit board element 3 can also be prepared with the associated frame member 5, and then equipped with the components. As a result, it is possible to perform an overall assembly in which the two printed circuit board elements 3, 13 are electrically interconnected, for example by means of a flexible connection 63, assembled, and finally connected in a manner sealed, for example by plastic laser welding. For, among others, increasing the stability of the cover member 7, the second printed circuit board member 13 may for example be made from a thicker board or board, or it is possible to provide a support support 65, which can for example be reported by brazing, internally, on the second printed circuit board element 13. In the case of the electronic module 1 shown in Figure 8, detection elements 67, 69 are provided both on an inner surface towards the receiving housing 11, and on an outer surface. With the aid of these detection elements, it is possible to detect, for example, variable magnetic fields. Such variable magnetic fields can be produced in a motor vehicle gearbox, for example using sensor wheels 71 equipped with magnets, so that the electronic module 1 can advantageously be configured as a device of Gearbox control allowing, among other things, to detect rotational speeds of components of the gearbox.
    [0011] FIG. 9 shows an embodiment of an electronic module 1, in which an electrical interconnection link between the first printed circuit board element 3 and the second printed circuit board element 13 is not carried out. inside the receiving housing 11, but the two printed circuit board members 3, 13 are electrically interconnected on an outer side. This can for example be done via a flexible printed circuit sheet 75 or a flat cable. It will be necessary here to protect against harmful influences of fluids or aggressive agents in a gearbox of a motor vehicle, or against dirt, only the open contact areas, for example by the application of a layer of varnish 73. In the embodiment shown in FIG. 10, the assembly of a circuit of an electronic module 1 is distributed over three printed circuit board elements 3, 13, 77. A third printed circuit board element 77 is here arranged transversely, in particular perpendicularly, to the other two printed circuit board elements 3, 13, and is supported, in the example shown, on an inner surface of the frame element 5. It is here connected to the first printed circuit board element 3, via a partially flexible zone 79 and a brazing connection 81. Alternatively or in addition, it is for example possible to connect electrically. the first and third printed circuit board members 3, 77 through a channel 83 through which a solder or solder minivage can be introduced.
    [0012] Figures 11 and 12 show a top view and a side view of a partial area inside a receiving housing 11 of an electronic module. In this case, a relatively heavy electronic component 85, for example a wire component such as a capacitor, is attached to the first printed circuit board element 3. In order to be able to support this heavy electronic component 85, a structure of reception 87 complementary configuration thereof is performed on the frame member 5, the component 85 can be housed there, for example by complementarity of shapes, and thus be maintained there. 10
    权利要求:
    Claims (3)
    [0001]
    CLAIMS1 °) Electronic module (1), comprising a first printed circuit board element (3) on which is arranged at least a first electronic component (9); and a frame member (5); a cover member (7); the first printed circuit board member (3), the frame member (5) and the cover member (7) sealingly enclosing a receiving housing (11); and said at least one electronic component (9) being arranged inside the receiving housing (11), characterized in that the electronic module (1) has a second printed circuit board element (13) on which is arranged at least one second electronic component (15), the second printed circuit board element (13) is spaced apart, at least in certain partial areas, from the first printed circuit board element (3) and is electrically connected to the first printed circuit board element (3), and the second electronic component (15) is arranged in the receiving housing (11).
    [0002]
    2 °) electronic module according to claim 1, characterized in that the second printed circuit board element (13) rests, at least at partial areas of its edge, on the frame member (5).
    [0003]
    Electronic module according to Claim 1 or Claim 2, characterized in that the first printed circuit board element (3) is made from a thermosetting material, and micro-structuring (21) is carried out in the first printed circuit board element (3), at an interface surface where the first printed circuit board element (3) is adjacent to the frame element (5) .4 °) Electronic module according to one of the preceding claims, characterized in that the first printed circuit board element (3) and the second printed circuit board element (13) differ in their substrate types. Electronic module according to one of the preceding claims, characterized in that the first printed circuit board element (3) and / or the second printed circuit board element (13) are planar. Electronic module according to one of the preceding claims, characterized in that the second printed circuit board element (13) is located, at least in partial areas, at a distance from the cover element (7). 7 °) electronic module according to one of the preceding claims, characterized in that the second printed circuit board element (13) is held by clamping, at least at partial areas of its edge, between the frame member (5) and the cover member (7). 8 °) electronic module according to one of claims 1 to 5, characterized in that the second printed circuit board element (13) forms at least a portion of the cover member (7). Electronic module according to one of the preceding claims, characterized in that it further comprises a third printed circuit board element (77) which is arranged transversely to the first and / or second plate element. printed circuit board (3, 13) .3510 °) Electronic module according to one of the preceding claims, characterized in that the first and / or second printed circuit board element (3, 13) is arranged in a border area, an electronic component (85) attached to the frame member (5). Electronic module according to one of the preceding claims, characterized in that the first printed circuit board element (3) is electrically connected to the second printed circuit board element (13) by means of a connection. electrical continuity by bonding, cable and / or flexible film. Electronic module according to one of the preceding claims, characterized in that the first printed circuit board element (3) is electrically conductive connected to the second printed circuit board element (13) by a contact element. (31) adapted for blind mounting. Electronic module according to one of the preceding claims, characterized in that the second printed circuit board element (13) does not completely cover the first printed circuit board element (3) inside the housing. reception (11). 14 °) gearbox control apparatus, comprising an electronic module (1) according to one of claims 1 to 13.30
    类似技术:
    公开号 | 公开日 | 专利标题
    FR3018989A1|2015-09-25|ELECTRONIC MODULE, IN PARTICULAR FOR A GEARBOX CONTROL APPARATUS
    EP3176918B1|2019-10-23|Electronic architecture intended for powering an electric machine for a motor vehicle
    FR2875374B1|2019-10-25|VEHICLE POWER CONVERTER
    EP1792526B1|2009-07-15|Electronic device provided with an integrated heat spreader
    FR2620296A1|1989-03-10|HOUSING FOR ELECTRONIC CIRCUIT
    FR2865098A1|2005-07-15|ELECTRONIC CONTROL UNIT AND METHOD FOR ITS PRODUCTION
    FR2792803A1|2000-10-27|CARD-MOUNTED SEMICONDUCTOR DEVICE
    EP3220729B1|2019-05-22|Electronic device and method for assembling such a device
    EP3621093A1|2020-03-11|Capacitive block comprising a heat sink
    EP2288001A1|2011-02-23|Alternator with synchronous rectification equipped with an improved electronic power module
    EP1047294A1|2000-10-25|Insulated metallic substrate for printed circuit boards
    EP1054445A1|2000-11-22|Electronic package on circuit board and its manufacture
    EP3177123B1|2021-02-24|Mounting of an electronic card, assembly of an electronic card and such a mounting, voltage converter comprising same, and electric machine for motor vehicle comprising same
    EP0323295A1|1989-07-05|Method for fixing an electronic component and its contacts on a carrier
    EP1116424B1|2005-06-01|Electronic assembly comprising a sole plate forming a heat sink
    EP2288002A1|2011-02-23|Alternator with synchronous rectification equipped with an improved electronic power module
    FR2585881A1|1987-02-06|HOUSING FOR A HYBRID CIRCUIT
    FR3076974A1|2019-07-19|Reinforced electronic device for an electric motor
    FR3041211A1|2017-03-17|DEVICE FOR CONTROLLING THE POWER SUPPLY OF A LIGHT SOURCE FOR A LIGHTING DEVICE OF A MOTOR VEHICLE
    FR3064878A1|2018-10-05|DEVICE FOR DISSIPATING HEAT FROM AN ELECTRONIC DEVICE
    FR3060847A1|2018-06-22|ELECTRONIC POWER MODULE COMPRISING A THERMAL EXCHANGE FACE
    WO2014154567A1|2014-10-02|Control module for an electric appliance
    FR3060936A1|2018-06-22|PROTECTIVE BELT, ELECTRONIC POWER MODULE AND ELECTRICAL POWER SUPPLY COMPRESSOR PILOTED BY SUCH AN ELECTRONIC POWER MODULE
    FR3088492A1|2020-05-15|BRUSH HOLDER OF ROTATING ELECTRIC MACHINE PROVIDED WITH AN ELECTRONIC CONTROL CIRCUIT WITH INTEGRATED TRACKS
    FR2638050A1|1990-04-20|Device for transferring a component to a hybrid circuit
    同族专利:
    公开号 | 公开日
    DE102014205385A1|2015-09-24|
    CN104955290A|2015-09-30|
    引用文献:
    公开号 | 申请日 | 公开日 | 申请人 | 专利标题
    US20100271791A1|2007-09-07|2010-10-28|Continental Automotive Gmbh|Module for Integrated Control Electronics Having Simplified Design|
    DE102011089474A1|2011-12-21|2013-06-27|Robert Bosch Gmbh|Electronic module for a vehicle|
    DE102012213917A1|2012-08-06|2014-02-20|Robert Bosch Gmbh|Component sheath for an electronics module|
    DE102013215227A1|2013-08-02|2015-02-05|Robert Bosch Gmbh|Encapsulated electronic module with Flexfolienanbindung, especially for a vehicle transmission control module|
    US5274570A|1989-05-22|1993-12-28|Mazda Motor Corporation|Integrated circuit having metal substrate|
    US5586388A|1991-05-31|1996-12-24|Nippondenso Co., Ltd.|Method for producing multi-board electronic device|
    JP2000307056A|1999-04-22|2000-11-02|Mitsubishi Electric Corp|Vehicle-mounted semiconductor device|
    DE102008018386A1|2008-04-11|2009-10-15|Siemens Aktiengesellschaft|Holding device with carrier element and circuit board|DE102015219571A1|2015-10-09|2017-04-13|Conti Temic Microelectronic Gmbh|Sensor dome assembly|
    DE102015223550A1|2015-11-27|2017-06-01|Robert Bosch Gmbh|Electronic module and method for manufacturing an electronic module with a fluid-tight housing|
    JP6249037B2|2016-03-29|2017-12-20|マツダ株式会社|Automatic transmission and manufacturing method of automatic transmission|
    DE102016215411A1|2016-08-17|2018-02-22|Conti Temic Microelectronic Gmbh|Frame for an electronic circuit board and electronic circuit board|
    CN106358407B|2016-12-02|2022-02-11|极导电子科技无锡有限公司|Controller of electric vehicle|
    DE102017204338A1|2017-03-15|2018-09-20|Robert Bosch Gmbh|Electronic control module and method of manufacturing an electronic control module|
    DE102017209179A1|2017-05-31|2018-12-06|Conti Temic Microelectronic Gmbh|electronics assembly|
    DE202017105514U1|2017-09-12|2018-12-14|Tridonic Gmbh & Co Kg|Housing for an electrical operating device for bulbs|
    EP3495897B1|2017-12-08|2020-08-12|ETA SA Manufacture Horlogère Suisse|Timepiece comprising an electric motor secured to an attachment plate|
    FR3103887A1|2019-11-29|2021-06-04|Valeo Systemes Thermiques|Electric heating device for a heat transfer liquid for a motor vehicle|
    法律状态:
    2016-03-22| PLFP| Fee payment|Year of fee payment: 2 |
    2017-03-23| PLFP| Fee payment|Year of fee payment: 3 |
    2018-01-12| PLSC| Search report ready|Effective date: 20180112 |
    2018-03-26| PLFP| Fee payment|Year of fee payment: 4 |
    优先权:
    申请号 | 申请日 | 专利标题
    DE102014205385.4A|DE102014205385A1|2014-03-24|2014-03-24|Electronic module, in particular for transmission control unit, with two printed circuit board elements stacked one above the other|
    [返回顶部]